It is still offering the unbeaten flexibility as well as the full customization capability that the Datacon 2200 evo platform is so well known for. Datacon 2200 evoplus Innovative Solution for Innovative Products Future Proof. While significantly increasing the accuracy and placement capabilities the Datacon 2200 evo advanced does not forget its roots in the Multi Module Attach family. 2200 evo plus Future Proof Equipment Innovative Solution for Innovative Products The 2200 evoplus die bonder for Advanced Packaging assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi.With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability, using a new camera system and thermal compensation. Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.Accuracy & Flexibility for your mass production The Datacon 2200 EVO Plus is enhanced further with key features for higher bonding accuracy, achieving + 7 microns and 3 sigma X/Y placement accuracy. Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 Warning: Missing argument 3 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251
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